Over the last few generations of Intel Core processors, particularly with the endless stream of Skylake based processors which have been getting pretty tiresome, however Intel’s marketing team seem to have put more effort in the packaging of which their processors come in than the processors within with fancy retail packaging.

Usually Intel provided the bare example of a box, that being a rectangle cardboard box, however Intel then decided to reinvent the wheel starting with their 9th gen processors.

First we had that horrendous waste of cardboard and plastic with the dodecahedron shaped retail packaging for the Intel Core i9-9900K. While everything else below the flagship were deemed unworthy of having a horrible paper weight as they actually came in an actual box.

Intel learning from their mistakes set to make amends with their 10th gen CPUs. In this case we got a special cut-away box design with the Intel Core i9-10900K.

A nice plastic clamshell window within giving you a glimpse within, which just shouted that it was somehow heat warped as the i9 10900K had managed to melt it due to the thermal load that the processor omits even without any current passing through it.

 

And of course who could forget the laughable 10th gen “KA” processors which was a partnership between Intel and Marvel to sell you printed cardboard boxes with your favorites from the MCU, but of course in typical Intel fashion “KA” processors did not come with with a copy of the Marvel Avengers video game, which was probably a good thing considering how garbage the game actually is but nonetheless it was a massive rip-off.

However to finally round things off with their 11th gen Core processors, with the last of the 14nm+++++++ CPUs (at least we hope) there is a new box in town. Cementing the fact that Intel care more about box design than architecture design.

With the upcoming Rocket Lake, presumably named for its thermal output too. The Intel Core i9-11900K has topped the “Boxmark” charts once again with what can only be described as rubbish. It genuinely looks as it was damaged during shipping, that some Antifa landwhale sat on it crumpling it in the process.

Or perhaps this wedged shape box design is in reference to the sheer thermal output of the 11900K, much like its Comet Lake predecessor, Intel has once again melted the box.

If only Intel spent as much time putting development into their processing foundries or architectures design as they do figuring out new ways to justify the price of the products through shaped cardboard and plastic, their products might actually end up being somewhat justified of their asking price.

Rocket Lake is set to be the first excursion from the antiquated Skylake architecture which has been a tumor, growing inside the PC market since 2015, unfortunately for Intel it still couldn’t manage to let go of their 14nm processing node which belongs in a nursing home at this point. With Intel scrambling to port Cypress Cove onto their 14nm process and being met with disastrous consequences.

As you may know Intel’s 11th gen Core processors are due to be replaced before the years end with their 12th generation processors which will feature the Golden Cove micro-architecture however on yet another new socket (LGA 1700) while utilizing their 10nm SuperFin process finally. Golden Cove is rumored to feature decent IPC gains over rudimentary “Tiger Lake” processors which are built on 10nm.

Featuring Intel’s Xe (Gen 12) integrated graphics this would mark Raja Koduri’s first time back in the desktop market, as the SVP of Intel’s “Architecture, Software and Graphics” division, he is in charge of the driver stack and the hardware involved in the Iris Xe integrated GPU, lord help us all.

His track record with hot and slow products with terrible software support does not bode well for the Xe, hopefully the “new Jew” running the show at Intel, Pat Gelsinger, will keep a better eye on Koduri than Bob Swan.

Rocket Lake is “heating up” to be the latest of Intel’s “failed science experiments”. It feels like the Frankenstein of CPUs and it hasn’t even released. Wrong node for the architecture and most certainly will be dead on arrival.

With an shorter life expectancy than a house fly, Rocket Lake should have stayed in the labs as a proof of concept that backporting can be done, not taking up shelves in retail stores.

AMD wouldn’t really have to do anything to counter Intel’s Rocket Lake as it holds a commanding victory in multi-threading workloads, efficiency as well as single core performance depending on the application. Esepcially considering the regressive gaming performance figures we’ve seen of the 11900K compared to its predecessor the 10900K, Intel’s Rocket Lake will most certainly be EOL before it even releases